Semiconductors & Electronics
Eliminate the Microscopic Flaws That Cause Field Failures
In electronics manufacturing, you're in a constant battle against microscopic defects that can render a device useless. A single misplaced solder ball or a slightly misaligned component can derail a product launch. You need nanometer-level precision, but you can't afford months of integration time for a new inspection system.
Overview.ai is built for speed—both in production and deployment. Empower your operators to set up and run advanced PCB and component inspections, catching the defects that traditional systems miss, with no coding required.
Why Overview.ai for Electronics?
Increase first pass yield (FPY), reduce costly rework, and protect your brand from the fallout of device failures. Solve complex inspection challenges in hours, not weeks, and get actionable data to fine-tune your SMT line and upstream processes.
Key Applications
SMT & PCB Inspection
Go beyond standard AOI. Our AI can identify defects that rule-based systems miss, such as subtle solder bridging, insufficient paste, tombstoning, and "black pad" defects on BGAs, dramatically reducing false positives.
Advanced PCB Assembly Verification
Catch errors before they become expensive rework. Verify component placement accuracy and orientation for every resistor, capacitor, and IC before reflow soldering to prevent placement errors that traditional AOI systems catch too late.
Component Height, Tilt & Coplanarity
Ensure every component is perfectly seated. Our system uses 3D analysis to verify the Z-height and tilt of critical components, ensuring coplanarity for connectors and BGAs to prevent open circuits.
Connector & Flex Cable Inspection
Eliminate bottlenecks from manual inspection. Our AI can instantly spot bent, missing, or contaminated pins inside high-density connectors and inspect flexible cables for tears, delamination, or improper seating.
Semiconductor Packaging Inspection
Ensure perfect connections at the chip level. Verify wire bond placement and integrity on semiconductor packages, detecting broken or misplaced bonds. We inspect die attach quality for voids or excess material that affects thermal performance.
Final Assembly & Cosmetic Inspection
Guarantee a flawless customer experience. Find microscopic scratches, pits, and adhesive overflow on device housings, screens, and camera lenses, ensuring every product that ships is cosmetically perfect.