Electronics High Speed Array Connector Pin Defects and Dust Detection
A leading global interconnect manufacturer needed to automate the final quality check of high-density automotive connectors. The challenge was immense: every single pin needed to be clearly aligned, multiple classes of pin issues had to be detected (missing, broken, bent), and tiny debris of any shape, color, and orientation had to be detected—all while maintaining a 1-second cycle time.
“This was difficult as the dust particles were always unique & there were multiple classes of defective pins. It was great how quickly we got this working and using the multi-model version was a big advantage.”
— Line Operator
The Challenge
The customer produces high-value connectors used in critical systems. A single failure, such as a bent pin or dust particle, could cause a system failure. Challenges included: dust particles could be placed anywhere within parts, pins could fail multiple ways (missing, bent, broken), shape/color/orientation of particles were unknown, and some particles could blend in with backgrounds.
Our Solution
We deployed a quality cell using the OV80i paired with specialized optics (0.3x telecentric lens, on-axis ring light) to reduce distortion and improve image consistency. With only 4 training images, we achieved 100% accuracy detecting missing pins, bent pins, broken pins, and dust/debris.
Hardware Setup
- • Camera: OV80i at 85mm distance
- • Lens: 0.3x telecentric lens
- • Light: On-axis ring light
Defects Detected
- • Missing pins, Bent pins
- • Broken pins, Dust & debris
- • Multi-model inspection
Technical Implementation Details
Our engineering team deployed a comprehensive solution including hardware setup, camera configuration, alignment procedures, and AI model training...
Performance Results
Detailed testing results, accuracy metrics, ROI calculations, and deployment timeline...
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