Micro-electronics Connectors Soldering Defect Detection
A global leader in electronics manufacturing faced a critical challenge in ensuring the quality of its high-density PCB connectors. Traditional quality methods struggled to detect subtle and varied defects across a large number of pins. Overview AI's OV80i system provided a complete solution, demonstrating 100% inspection accuracy with a zero miss rate.
“I thought an AI system may catch 2-3 defect types, then we'd need multiple cameras to capture all defects. But the Overview AI team persisted in achieving the lens & lighting that would capture all 7, saving us lots of time & money.”
— Plant Manager
The Challenge
We worked with an electronics manufacturer who required an inspection system to check both the top and bottom sides of PCBs for minute defects in the soldering of connector pins. This was challenging due to diverse defect portfolio (7 distinct types), subtle visual cues including depth variations impossible for typical 2D systems, and maintaining high accuracy over long periods & production volumes.
Our Solution
We implemented a detailed segmentation algorithm on the OV80i using a 3-color AOI light to capture subtle depth deviations and a 0.3x magnification telecentric lens to limit magnification distortions (perspective error). This setup ultimately allowed us to reliably capture all 7 defect types in 1 system: false welding, solder deviation, low overlap, tin tip, tin balls, solder bridging, and insufficient tin.
Hardware Setup
- • Camera: OV80i at 110mm distance
- • Lens: 0.3x telecentric lens
- • Light: 3-color AOI light
7 Defect Types Detected
- • False welding, Solder deviation
- • Tin tip, Tin balls, Bridging
- • Low overlap, Insufficient tin
Technical Implementation Details
Our engineering team deployed a comprehensive solution including hardware setup, camera configuration, alignment procedures, and AI model training...
Performance Results
Detailed testing results, accuracy metrics, ROI calculations, and deployment timeline...
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