Connector PinInspection
Bent pins, true position drift, plating pitting, and uneven seating depth. High-density connectors fail in dozens of subtle ways that pin gauges miss. We score every pin individually.
High-density connector pin array from a customer assembly
The Defects We Catch on Pins
Real defect imagery from connector manufacturing customers.
Bent and skewed signal contacts
Uneven seating depth and retention
AI classifying every pin in a high-density array
Pin Defects We Catch
Bent & Buckled Pin Detection
Press-fit, compliant, and signal pin connectors all suffer mechanical handling damage that produces bent tips, lateral skew, and buckled shoulders. These faults pass contact pin gauges and silently produce intermittent field failures. Overview AI catches each pin individually across an OSFP host, QSFP-DD, or high-density backplane connector, with per-pin pass/fail and a fault map back to the operator HMI.
True Position & Seating Depth
Uneven seating depth on press-fit and compliant pins compromises retention force and signal continuity. Subtle true position drift in high-density arrays produces crosstalk barriers and impedance mismatch. The OV80i resolves the geometry at sub-pixel accuracy, scoring each pin against the nominal datum and flagging trend drift hours before scrap rates climb.
Plating & Surface Defects
Coax center pins and gold-plated contacts arrive from plating with defects that contact resistance testing cannot see: bath pitting, plating thinning, scratches, foreign material, and oxidation. Our system trains on real plating-line examples and flags each defect class with pixel-level localization, supplementing or replacing destructive cross-section sampling.
Unified High-Density Connector QC
A leading high-density connector manufacturer consolidated four separate inspection stations onto a single Overview AI platform: bent pin detection, BGA solder ball inspection, wafer alignment for crosstalk barriers, and final-assembly cosmetic check. The unified workflow reduced false rejects and gave their reliability engineers one source of truth for every connector defect class.
Built for High-Density Connectors
Density keeps climbing. Defect modes keep multiplying. The model keeps up.
Per-Pin Resolution
Score every pin individually. No averaging away a single bent contact across the array.
Reliability Audit Trail
Every connector logged with its inspection image, fault map, and timestamp. Built for IATF and AS9100 audits.
Add New Defect Classes Anytime
New connector geometry, new defect mode, new plating chemistry. Retrain in under an hour without vendor involvement.
Ready to Catch Every Bent Pin?
Send us a sample run. We will return a working pilot model in days, not months.