PCB & FPCInspection
Catch what AOI misses. Missing components, polarity flips, trace damage on flex, contamination, and cosmetic flaws on populated boards. One platform, every defect class, every product variant.

Glue, solder, components, and connectors on one PCBA
Where Our Cameras Inspect Boards
Real defect imagery from automotive, connector, and consumer electronics lines.

Foreign objects flagged on a populated board

Per-connector Pass/Fail on cable assemblies

Real AI Solder-ROI Pass and Defect calls
PCB & FPC Defects We Catch
Populated PCBA Inspection
Inspect placed components for presence, orientation, polarity, and skew on every assembly that comes off the SMT line. The model trains on a few dozen reference boards and reliably flags missing capacitors, flipped ICs, tombstoned passives, and misaligned connectors. Recipe creation that took weeks on conventional AOI takes a single shift.
FPC and Rigid-Flex Defect Detection
Flex circuits expose unique failure modes: trace damage at the bend radius, coverlay delamination, scratches on the polyimide, and contamination in the gold pad areas. Overview AI handles the reflective and curved surfaces that defeat structured-light AOI, and the same workflow extends to rigid-flex hybrids without separate recipes.
Solder Joint & Conformal Coating QC
Cold joints, solder bridges, voiding, and conformal coating misses fail downstream test or, worse, escape to the field. The same AI model that inspects component placement also scores joint quality and coating coverage, with pass/fail at the joint level and trend data exported to your MES.
Cosmetic Defects, Scratches, and Markings
Visible scratches, solder mask scuffs, silkscreen errors, lot code legibility, and barcode quality all matter for high-end consumer electronics and medical devices. Our vision system unifies cosmetic inspection and OCR validation on a single platform, eliminating the parallel inspection stations that traditionally split these checks across separate vendors.
Unified PCB & FPC Inspection
One platform, every defect class, every board variant.
Hot Swap Between Variants
Switch board variants without recipe re-engineering. The model handles geometric variation gracefully.
SPC and MES Export
Every joint, every defect, every cycle logged to your existing systems. Native EtherNet/IP, Profinet, Modbus TCP, and REST.
Haystack Discovery
Surface anomalies you did not know to look for. Then retrain to catch them in production, without a vendor.
Ready to Replace Your AOI Black Box?
See the same boards, same defects, modeled by our team and your team in the same week.