Hot Bar SolderingInspection
Fine-pitch solder QC at production speed. Hot bar bonding leaves no margin for bridges, tombstoning, or insufficient wetting. We catch every joint, every cycle, with X-Y fault data routed straight to your PLC.
Solder bridge defect, the kind we catch at line speed
The Defects We Catch on Soldered Joints
Real defect imagery from electronics manufacturing customers.
AI pass/defect on a populated PCBA
Real Pass and Defect calls on solder joints
Per-pin Pass and Fail calls on soldered leads
Solder Defects We Catch
FPC and Flex Circuit Bonding
Hot bar bonding to flexible printed circuits operates on sub-0.5 mm pad pitches where any solder bridge or skip fails the assembly. Traditional AOI struggles with the reflective polyimide substrate and shallow joint geometry. Overview AI trains on a small set of real production samples and reliably classifies solder bridge, insufficient solder, cold joint, lifted pad, and substrate scorch.
Laser and Hot Bar Reflow on Connectors
Pluggable connectors and DAC paddle cards rely on hot bar reflow to terminate dozens of contacts at once. Tin balls, solder bridging, tin tips, low overlap, insufficient solder, solder deviation, and false welding all compromise signal integrity. Our system trains with a small set of examples and detects all common issues even under glare or variable joint geometries.
BGA & Fine-Pitch Solder Ball Inspection
Ball voiding, missing balls, and ball splash on BGA and automotive Ethernet header reflow create field failures that traditional rule-based vision cannot reliably segment. Overview AI handles the reflective specular variation across the ball surface and provides per-ball pass/fail with pixel-level localization. Faults map directly to X-Y coordinates the operator can act on.
Auto Line Pause and PLC Integration
A major electronic chip manufacturer eliminated escapes from minor soldering defects by integrating Overview AI directly with the PLC. Node-Red logic on the camera pauses the line on any failure and pushes X-Y fault coordinates to the operator HMI. No PC. No middleware. No additional license servers.
Why Electronics Manufacturers Choose Us
Train, deploy, and retrain on the same hardware that runs your production inspection.
Handles Reflective Joints
AI models adapt to specular glare, oxidation variability, and flux residue that breaks rule-based vision and AOI.
X-Y Fault Mapping
Defects flow to the HMI with exact coordinates, so the operator does not have to hunt for the failed joint.
No Special Vision Team
Your process engineers train models from a browser. No PhDs, no system integrators, no waiting on the OEM.
Ready to Eliminate Solder Escapes?
See how a pilot model trained on your samples performs in your line conditions.